The performance of amorphous InGaZnO4 thin film transistors with three different gate dielectrics (SiO2, SiON, and SiNx) is reported. The gate dielectric films were prepared by plasma enhanced chemical vapor deposition with SiH4, N2O, and NH3 gases at 250 degrees C. Current-voltage (C-V) and refractive index characterization showed that different film compositions were achieved when changing the flow rate of N2O in the precursor gas mixture. The use of SiNx films reduced the interfacial roughness of the channel/gate dielectric by a factor of 2.3 compared to SiO2. This results in an improvement of saturation mobility of the thin film transistors (TFTs) by a similar factor. An enhancement of subthreshold gate-voltage swing and drain current on-to-off ratio for TFTs with SiNx was also attributed to the reduction of the trap density at the channel/gate-dielectric interface. (C) 2009 American Vacuum Society. [DOI: 10.1116/1.3058717]