Composition-Dependent Curing Behavior and Peel Strength of Epoxy Resins for Printed Circuit Boards (PCBs)

Jae-Choon Cho; Hwa-Young Lee; Sung-Taek Lim; Moon-Soo Park; Yong-Soo Oh; Mi-Suk Cho; Young-kwan Lee

Macromolecular Research, Vol.18, No.1, 47-52, January, 2010

DOI10.1007/s13233-009-0095-y Export Citation

Composition-Dependent Curing Behavior and Peel Strength of Epoxy Resins for Printed Circuit Boards (PCBs)

Jae-Choon Cho, Hwa-Young Lee¹, Sung-Taek Lim¹, Moon-Soo Park¹, Yong-Soo Oh¹, Mi-Suk Cho , and Young-kwan Lee^†

Department of Chemical Engineering, Sungkyunkwan University, Suwon, 440-746, Korea
¹eMD center, Central R&D Institute, Samsung Electro-Mechanics Co., LTD., Suwon, Korea

E-mail:

Insulating films for hand-held phone printed circuit boards (HHP PCBs) were manufactured from a variety of epoxy resin formulations. The epoxy resin formulations were prepared by varying the curing accelerator content. The curing behavior was investigated by viscosity measurements under isothermal conditions using a rheometer. The films were used in a general PCB manufacturing process and their adhesiveness to the electroplating layer was confirmed by peel strength tests. Their surface morphology after desmearing was examined by SEM. The peel strength of the epoxy films with a copper layer was directly dependent on their surface roughness.

Keywords:epoxy resin;PCB;curing;peel strength;surface roughness

[References]

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Martin MD, Ormaetxea M, Harismendy I, Remiro PM, Mondragon I, Eur. Polym. J., 35, 57 (1999)
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Nunez L, Fraga F, Castro A, Nunez MR, Villanueva M, Polymer, 42(8), 3581 (2001)
Lamberti G, Titomanlio G, Macromol. Symp., 185, 167 (2002)
Lamberti G, Titomanlio G, Brucato V, Chem. Eng. Sci., 57(11), 1993 (2002)
Lamberti G, Brucato V, J. Polym. Sci. B: Polym. Phys., 41(9), 998 (2003)
Titomanlio G, Lamberti G, Rheol. Acta, 43(2), 146 (2004)
Seo J, Jang W, Han H, Macromol. Res., 15(1), 10 (2007)

[Referenced By]

[Related Articles]

[1] Siau S, Vervaet A, Schacht E, J. Electroanal. Chem., 151, C133 (2004)

[2] Holden H, Circuit World, 23 (1997)

[3] Seo J, Jang W, Han H, Macromol. Res., 15(1), 10 (2007)

[4] Truong TL, Luong ND, Nam JD, Lee Y, Choi HR, Koo JC, Nguyen HN, Macromol. Res., 15(5), 465 (2007)

[5] Lau JH, Lee SWR, IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 25, 51 (2002)

[6] Lamberti G, Titomanlio G, Chem. Eng. Process., 44(10), 1117 (2005)

[7] Grundke K, Michel S, Osterhold M, Prog. Org. Coat., 39, 101 (2000)

[8] Gabriel S, J. Oil Coaat. Chem. Assoc., 58, 52 (1975)

[9] de Lange PG, J. Coat. Technol., 56, 23 (1984)

[10] Orchard SE, Prog. Org. Coat., 23, 341 (1994)

[11] Bieleman J, in Lackadditive, J. Bieleman, Ed., Wiley, Weinheim, 1998, p. 171

[12] Nix VG, Dodge JS, J. Paint Technol., 45, 59 (1973)

[13] Gabriel S, J. Oil Coat. Chem. Assoc., 58, 52 (1975)

[14] Orchard SE, Prog. Org. Coat., 23, 341 (1994)

[15] KR Patent, 0109264 (2007).

[16] Martin MD, Ormaetxea M, Harismendy I, Remiro PM, Mondragon I, Eur. Polym. J., 35, 57 (1999)

[17] Alger MSM, in Polymer Science Dictionary, Elsevier Applied Science, London, 1989.

[18] Nunez L, Fraga F, Castro A, Nunez MR, Villanueva M, Polymer, 42(8), 3581 (2001)

[19] Lamberti G, Titomanlio G, Macromol. Symp., 185, 167 (2002)

[20] Lamberti G, Titomanlio G, Brucato V, Chem. Eng. Sci., 57(11), 1993 (2002)

[21] Lamberti G, Brucato V, J. Polym. Sci. B: Polym. Phys., 41(9), 998 (2003)

[22] Titomanlio G, Lamberti G, Rheol. Acta, 43(2), 146 (2004)

[23] Seo J, Jang W, Han H, Macromol. Res., 15(1), 10 (2007)