Bumps are indispensable microconnectors for high density interconnections and are electrodeposited within deep cavities. With a cavity aspect ratio of 0.25, the initial bump shape is flat at 0 rpm on the rotating disk electrode. The bump shapes form humps on the upper stream sides at slower rotations of 10 and 20 rpm. The hump on the upper stream side shifts to the downstream side at a higher rotation of 100 rpm. Vortices form both at the cathode and the photoresist corners of the upper and lower stream sides. The formation of the humps and their shift to the downstream side are caused by the difference in transport during the diffusion and convection of the vortices. With a cavity aspect ratio of 3.3, the cross section becomes flat at slower rotation speeds of 0, 10, 20, and 100 rpm. The vortices do not reach the cathode, and the transport is controlled by the diffusion. At the highest rotation speed of 1250 rpm, the vortex touches the cathode surface. The transport is controlled by the convection, and the flux value becomes 60 times greater than those at 10, 20, and 100 rpm. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3232014] All rights reserved.