Electroless Ni-P nanoparticles deposition enhanced by UV exposure was investigated to catalyze the synthesis of carbon nanotubes (CNTs) and carbon nanofibers (CNFs) by thermal chemical vapor deposition at 400 degrees C for interconnect formation that can reduce process complexity. The Ni-P nanoparticles with a size of 6-15 nm were deposited by using a UV-assisted electroless plating on the SiO2 trench wall at similar to 28 degrees C for CNF wiring formation. Besides, the Ni-P nanoparticles were selectively deposited at the bottom of the via-hole with a size of 100 nm by using electroless plating at 70 degrees C for CNT-via formation.