Film insert molding (FIM) has been modeled numerically to predict residual stress and viscoelastic deformation of the part. Nonisothermal three dimensional flow analysis for filling, packing, and cooling stages was carried out by using a commercial software. It was assumed that the inserted film was solid throughout the entire molding procedure although remelting could occur at the interface with the substrate. The flow analysis results, e.g., temperature, stress, and density distribution in the substrate domain, were transported to a finite element stress analysis program for viscoelastic stress analysis. Deflection of the FIM part was obtained as soon as the part was ejected from the mold by assuming isotropic elastic material. The residual stress distribution in the FIM part was acquired by removing the constraints along the boundary of the molded part. Viscoelastic deformation of the FIM part was predicted by performing viscoelastic stress analysis in order to understand long term behavior of the FIM part when exposed to room temperature. Durability of automotive and electronic parts produced by the film injection molding can be predicted by the procedure adopted in this study.