A novel amide and imide copolymer, poly(N-phenylmethacrylamide-co-N-(p-hydroxyphenyl)maleimide) was synthesized for the matrix resin of ultraviolet (UV) photoresist. Elemental analysis and self-polymerization experiment verified that this copolymer was very close to 1:1 (molar ratio) in composition and was predominately alternating. It was able to dissolve in various organic solvents and form uniform curing film when spin-coating. Its differential scanning calorimetry and thermogravimetry analysis test showed good thermal stability and its glass transition temperature (T-g) was about 280 degrees C. Photolithographic experiment indicated that the UV photoresist formulated with this copolymer as matrix resin was achieved the resolution of about 5 mu m, the contrast of 3.001, and the sensitivity of 32 mJ/cm(2). With good plasma etching resistance, the photoresist studied was able to bear 250 degrees C for 30 min without thermal deformation during the thermal resistance test. POLYM. ENG. SCI., 49:1621-1626, 2009. (C) 2009 Society of Plastics Engineers