This article reviews a novel method to produce microembossed features with an aspect ratio of three and negligible flash on polymer surfaces. An embossing technique that utilizes localized heating (ultrasonic energy) was used with polystyrene and polypropylene substrates. It was demonstrated that when foamed substrates were used, the amount of flash produced was negligible compared to nonfoamed substrates, which has been a significant unresolved problem with embossing using localized heating. The depth of microembossed features as a function of heating times and amplitudes of ultrasonic embossing is detailed in this article, along with a characterization of complex embossed geometries. It was seen that embossing depth was generally proportional to heating time and amplitude until the maximum feature depth was achieved. Although this article deals with embossing of microfeatures for lab-on-a-CD applications, it is envisioned that it is also suitable for lab-on-a-chip applications. POLYM. ENG. SCI., 49:2204-2211, 2009. (C) 2009 Society of Plastics Engineers