Copper was selectively and anisotropically electroplated for a resistless metallization process using copper overburden with an inhibiting additive. Basic Red 12 (2-[3-(1,3-dihydro-1,3,3-trimethyl-2H-indol-2-ylidene)-1-propenyl]-1,3,3 -trimethyl-3H-indolium chloride) was used as an inhibiting additive in an electroplating bath. When this additive was added, copper overburden was observed on the surface to have features without accelerating additives. The shapes of the deposited copper varied as a function of the additive concentration and plating current density. This process shows significant advantages in fabricating micrometer copper structures without a patterned resist layer.