Gold patterns were prepared via the microcontact printing (MCP) of 3-aminopropyltriethoxysilane (gamma-APS) on plasma etched polyimide films, followed by the layer-by-layer (LBL) deposition of gold nanoparticles (GNPs), O-2 plasma etching, and sintering. First, the polyimide film on silicon wafer was modified via water plasma etching, followed by the MCP of gamma-APS using a flat polydimethylsiloxane (PDMS) stamp. Next, the multilayer of GNPs was formed on the gamma-APS layer by the LBL deposition of citrate-capped GNPs and poly(ethyleneimine) (PEI). Then, the samples were subjected to O-2 plasma etching to remove PEI and citrates, and then sintering to produce metallic gold. Finally, gold patterns were prepared with a patterned PDMS stamp (line width of 10 mu m). The GNP multilayer was characterized by UV-vis/near-IR spectrometer, atomic force microscopy (AFM), optical microscopy (OM), alpha-step and electrical conductivity measurement by two-point probe method. Very clean gold patterns with electrical conductivity of 4.1 x 10(4) Omega(-1) cm(-1) (20-layer GNP) were obtained. (C) 2010 Elsevier Inc. All rights reserved.