Cu dissolution behaviors with select reagents (malonic acid, glycine, malic acid, citric acid) were investigated in terms of the functional groups of complexing agents. Based on the results of Cu dissolution rate testing at various pH values, as well as UV-visible analysis with the addition of cupric ions, reaction mechanisms and effects of each functional group are proposed. The effect of Cu oxide formation on the Cu dissolution rate was also investigated by monitoring Cu dissolution rates with various H2O2 concentrations and complexing agent concentrations. Additionally, the effect of the addition of corrosion inhibitor (5-aminotretrazole) on Cu dissolution was investigated. By combining the experimental results, we interpreted the Cu dissolution behaviors based on a competitive contribution from Cu oxide formation and complex formation between Cu (Cu oxide) and the complexing agent. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3522811] All rights reserved.