An overview of the different metal bonding techniques used for 3D integration is presented. Key parameters such as surface preparation, temperature and duration of annealing, achievable wafer-to-wafer alignment and electrical results are reviewed. A special focus is done on direct bonding of patterned metal/dielectric surfaces. A mechanism for copper direct bonding is proposed based on bonding toughness measurements, SAM, XRR, XRD, and TEM analysis. Dedicated characterization techniques for such bonding are presented. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3577596] All rights reserved.