The polyoxymethylene (POM) composites with different copper contents were prepared by extrusion. The thermal conductivity and tribological behavior of POM-Cu composites with various contents of copper particles were investigated by a hot disk thermal analyzer and an M-2000 friction and abrasion testing machine, respectively. The effect of copper particles on the thermal conductivity of POM composites was negligible when copper content was below 10 wt %. As the copper content increased, the thermal conductivity of composites increased and reached 0.477 W m(-1) K-1 for POM-25 wt A Cu composite, which increased by 35.9% compared with that of unfilled POM. The incorporation of copper particles into POM reduced the friction coefficient of POM composites. The wear mechanisms of POM-Cu composites were adhesive and abrasive wear. POLYM. ENG. SCI., 50:2153-2159, 2010. (C) 2010 Society of Plastics Engineers