화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Macromolecular Research, Vol.19, No.5, 442-447, May, 2011
DOI10.1007/s13233-011-0515-7  Export Citation
Preparation and Characterization of Conductive Chitosan-Poly[N-(3-trimethoxysilylpropyl)aniline] Hybrid Submicrostructures
Palanisamy Gomathi, Han Do Ghim†, and Dhanusuraman Ragupathy1
  • Department of Textile System Engineering, Kyungpook National University, Daegu, 702-701, Korea
  • 1Department of Chemical Engineering, Kyungpook National University, Daegu, 702-701, Korea
E-mail:
Conducting hybrid submicrostructures composed of chitosan (CS) and silica-based conducting poly[N-(3-trimethoxysilylpropyl)aniline] (PTMSPA) were prepared by graft copolymerization. The spherical and fibrous morphologies of the CS-PTMSPA hybrid submicrostructures could be observed by optical and field emission electron microscopy. Under room temperature conditions, the CS-PTMSPA graft copolymers possessed the uniformly distributed spherical submicroparticles with diameters in the range of ca. 400-1,000 nm. On the other hand, under ice cold conditions (5℃ ), CS-PTMSPA showed the development of randomly oriented fiber bundles. The diameter of a single fiber was in the range of ca. 100-500 nm. These CS-PTMSPA fibers were obtained by a temperaturedriven template-free self-assembly pathway. Spectroscopic and thermal evaluations confirmed that CS-PTMSPA graft copolymer had been prepared by an oxidative polymerization method. The electrochemical performance of the CS-PTMSPA submicrostructures were compared with CS and PTMSPA by cyclic voltammetry with the Fe(CN)6 3-/4- system as a redox marker. The CS-PTMSPA submicrostructures showed high electrical conductivity (difference between the anodic and cathodic peaks = 0.24 and 0.29 V for CS-PTMSPA sphere and fiber, respectively) compared to those of CS (0.14 V) and PTMSPA (0.20 V), which was ascribed to the relatively high surface-to-volume ratios of these submicrostructures.
Keywords:conductive hybrid submicrostructure;oxidative polymerization;temperature-driven template-free selfassembly.
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