화학공학소재연구정보센터
Korean Journal of Chemical Engineering, Vol.28, No.11, 2206-2210, November, 2011
The utilization of microencapsulated phase change material wallboards for energy saving
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Wallboards with micro encapsulated phase changing material (micro PCM) were used to investigate the performance and the energy saving characteristics as building materials in winter and summer climate conditions. The test house consisted of a boiler with under floor heating system, an air conditioner, micro PCM wallboard room and conventional wallboard room. The outer temperature of the rooms could be artificially controlled at the temperature range of .12 to 35 ℃. Micro PCM content in wallboards was 0-4 kg/m2. The melting temperature and latent heat of Micro PCM are 23 ℃ and 211 J/g. Also, micro PCM shows stable mechanical strength under 500 psi. As micro PCM content increased, the temperature fluctuations decreased. In case of micro PCM wallboard, temperature profiles in the room show stable and comfortable ranges. The optimum amount of micro PCM in wallboard to maximize energy saving efficiency was around 3 kg/m2.
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