In this study, polyamide 6 films were treated with different jet-to-substrate distances to investigate how it influenced the etching effect of plasma treatment. When the samples were too close or too far from the nozzle, the etching rate was almost not measurable. When the distance was 2mm, the etching rate was larger than that of other distance. Decrease in contact angle was observed under 2mm or 3mm of jet-to-substrate distance. However, the contact angle had no change when jet-to-substrate distance was 1mm or 6mm. It can be seen that the peel strength increased when jet-to-substrate distance was 2mmor 3mm, and the peel strength was the largest when jet-to-substrate distance was 2mm. However, the peel strength had no change when jet-to-substrate distance was 1mm or 6mm. These results were corresponding to SEM and XPS results. (C) 2010 Elsevier B.V. All rights reserved.