Molecular dynamics (MD) simulation is carried out to study the transport behaviors of a single deposited atom in Cu film homoepitaxy. We consider the normal Cu incident atoms impinging on the Cu (0 0 1) surface at four possible local impact sites (top, bridge, hollow and general). The observed transport behaviors of the deposited atom onto the surface include: direct adsorption (DA), penetration by atomic exchange, and transient penetration (TP), which a deposited atom penetrates the interstitial site and then rapidly migrates to a stable site on the surface. The results show that transport behaviors of the deposited atom are closely related to both the local impact site and the incident energy. The maximum increment of kinetic energy at every impact site approaches to a certain value except for the incident energy below 2.0 eV. Furthermore, as the incident energy is higher than the penetration threshold, TP behavior could be observed again in some energy ranges. This interesting phenomenon, which cannot be explained by the existing theories, is possibly attributed to the dynamical competition between the deposited atom and substrate atoms. (C) 2011 Elsevier B. V. All rights reserved.