Ag-Cu alloy film was deposited by arc ion plating (AIP). Atomic oxygen (AO) irradiation experiments were conducted using a ground AO simulation facility. The structure, morphology, composition and tribological property of the Ag-Cu alloy film before and after AO irradiation were investigated and compared with Ag film using X-ray diffraction (XRD), field emission scanning electron microscope (FESEM), X-ray photoelectron spectroscope (XPS) and ball-on-disk tribometer, respectively. In depth XPS analysis clearly shows that the affected thickness of Ag-Cu alloy film was greatly reduced and the oxidation product was mainly Ag2O, but AgO and Ag2O in case of pure Ag film. As a result, the Ag-Cu alloy film exhibited better AO resistant behaviors, and showed a stable friction and low wear after the AO irradiation. The AO resistant behaviors of the Ag-Cu alloy film were discussed in terms of the film microstructure. (C) 2011 Elsevier B. V. All rights reserved.