Large Scale Treatment of Perfluorocompounds Using a Thermal Plasma Scrubber

Sung-Han Han; Hyun-Woo Park; Tae-Hee Kim; Dong-Wha Park

Clean Technology, Vol.17, No.3, 250-258, September, 2011

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Large Scale Treatment of Perfluorocompounds Using a Thermal Plasma Scrubber

Sung-Han Han, Hyun-Woo Park, Tae-Hee Kim, and Dong-Wha Park^†

Department of Chemical Engineering and RIC-ETTP (Regional Innovation Center for Environmental Technology of Thermal Plasma), INHA University, 253 Yonghyun-dong, Nam-gu, Incheon, 402-751, Korea

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Thermal plasma has been presented for the decomposition of perfluorocompounds (PFCs) which are extensively used in the semiconductor manufacturing and display industry. We developed pilot-scale equipment to investigate the large scale treatment of PFCs and called it a “thermal plasma scrubber”. PFCs such as CF4, C2F6, SF6, and NF3 used in experiments were diluted with N2. There were two different types of experiment setup related to the water spray direction inside the thermal plasma scrubber. The first type was that the water was sprayed directly into the gas outlet located at the exit of the reaction section. The second type was that the water was sprayed on the wall of the quenching section. More effective decomposition took place when the water was sprayed on the quenching section wall. For C2F6, SF6, and NF3 the maximum destruction and removal efficiency was nearly 100%, and for CF4 was up to 93%.

Keywords:Thermal plasma;PFCs;C2F6;CF4;SF6;NF3;Scrubber

[References]

Chang JP, Coburn JW, J. Vac. Sci. Tech. A., 21(5), 145 (2003)
Allgood CC, J. Fluorine Chem., 122, 105 (2003)
Namose I, IEEE Tran. Semicon. Manufacturing., 16, 429 (2003)
Tsai WT, Chen HP, Hsien WY, J. Loss Prevention Proc. Ind., 15, 65 (2002)
Lee H, Yi J, Clean Technol., 4(1), 6 (1998)
Ravishankara R, Solomon S, Turnipseed AA, Warren RF, Science., 259, 194 (1993)
Houghton JT, Meira Filho LG, Callander BA, Harris N, Kattenberg A., Maskell K, “Climate Change 1995-The Science of Climate Change,” Cambridge University Press, New York, 121 (1996)
Kim DY, Park DW, Surf. Coat. Tech., 202, 22 (2008)
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McNabb J, Bischke S, Semiconductor International., 1(4), 131 (1998)
Xu XF, Jeon JY, Choi MH, Kim HY, Choi WC, Park YK, J. Mol. Catal. A-Chem., 266(1-2), 131 (2007)
Van Durme J, Dewulf J, Leys C, Van Langenhove H, Appl. Catal. B: Environ., 78(3-4), 324 (2008)
Radoiu MT, Radiat. Phys. Chem., 69, 113 (2004)
Chang MB, Lee HM, Catal. Today, 89(1-2), 109 (2004)
Wang YF, Wang LC, Shih ML, Tsaic CH, Chemosphere., 57, 1157 (2004)
Vartanian V, Beu L, Lii T, Semiconductor International., 23(6), 191 (2000)
Han SH, Seon HS, Shin PK, Park DW, “Conversion of SF6 by Thermal Plasma at Atmospheric Pressure,” Proceeding of ISPC-19, 460 (2009)
Factsage, Software Program, Version 5.5, Germany.
Rahmane M, Saucy G, Boulos MI, Rev. Sci. Instrum., 66(6), 3424 (1995)

[Referenced By]

[Related Articles]

[1] Chang JP, Coburn JW, J. Vac. Sci. Tech. A., 21(5), 145 (2003)

[2] Allgood CC, J. Fluorine Chem., 122, 105 (2003)

[3] Namose I, IEEE Tran. Semicon. Manufacturing., 16, 429 (2003)

[4] Tsai WT, Chen HP, Hsien WY, J. Loss Prevention Proc. Ind., 15, 65 (2002)

[5] Lee H, Yi J, Clean Technol., 4(1), 6 (1998)

[6] Ravishankara R, Solomon S, Turnipseed AA, Warren RF, Science., 259, 194 (1993)

[7] Houghton JT, Meira Filho LG, Callander BA, Harris N, Kattenberg A., Maskell K, “Climate Change 1995-The Science of Climate Change,” Cambridge University Press, New York, 121 (1996)

[8] Kim DY, Park DW, Surf. Coat. Tech., 202, 22 (2008)

[9] Kyoto Protocol, Climate Change Conference, Kyoto, Japan, Dec. 1-10 (1997)

[10] Van Brunt RJ, Herron JT, IEEE Trans. Electr. Insul., 25, 75 (1990)

[11] McNabb J, Bischke S, Semiconductor International., 1(4), 131 (1998)

[12] Xu XF, Jeon JY, Choi MH, Kim HY, Choi WC, Park YK, J. Mol. Catal. A-Chem., 266(1-2), 131 (2007)

[13] Van Durme J, Dewulf J, Leys C, Van Langenhove H, Appl. Catal. B: Environ., 78(3-4), 324 (2008)

[14] Radoiu MT, Radiat. Phys. Chem., 69, 113 (2004)

[15] Chang MB, Lee HM, Catal. Today, 89(1-2), 109 (2004)

[16] Wang YF, Wang LC, Shih ML, Tsaic CH, Chemosphere., 57, 1157 (2004)

[17] Vartanian V, Beu L, Lii T, Semiconductor International., 23(6), 191 (2000)

[18] Han SH, Seon HS, Shin PK, Park DW, “Conversion of SF6 by Thermal Plasma at Atmospheric Pressure,” Proceeding of ISPC-19, 460 (2009)

[19] Factsage, Software Program, Version 5.5, Germany.

[20] Rahmane M, Saucy G, Boulos MI, Rev. Sci. Instrum., 66(6), 3424 (1995)