Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation

Jong-Woo Bae; Wonho Kim; Suk-Hyeon Cho; Yong-Woo Hong; Jung-Eun Shin; Sang-Hyun Lee

Korean Journal of Chemical Engineering, Vol.17, No.1, 41-46, January, 2000

DOI10.1007/BF02789251 Export Citation

Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation

Jong-Woo Bae^†, Wonho Kim , Suk-Hyeon Cho, Yong-Woo Hong, Jung-Eun Shin, and Sang-Hyun Lee¹

Dept. of Chem. Eng., Pusan National Univ., Pusan 609-735, Korea
¹Division of Quatum Metrology, Korea Research Institute of Standards and Science, Taejon 305-600, Korea

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Highly thermal conductive EMCs (Exopy Molding Compounds) should be considered for the alleviation of thermal stress-related problems caused by low thermal conductivity, and high elastic modulus of EMCs and by a mismatch of CTE (Coefficient of Thermal Expansion) between EMCs and the Si-wafer. Compared to crystalline silica-filled EMCs, alumina filed EMC improved the value of thermal conductivity by 100% and lowered the value of CTE by 50%. As a result, compared to typical crystalline silica-filled EMCs, the thermal fatigue resistance of alumina-filled EMC was improved by sixfold.

Keywords:Thermal Fatigue;Thermal Conductivity;CTE;Alumina and EMCs

[References]

Biernath RW, Soane DS, Contemporary Topic Polym. Sci. (1992)
Incropera FP, Dewitt DP, "Introduction to Heat Transfer," 3(rd) Eds., John Wiley and Sons, New York, 50 (1996)
Kim W, Bae JW, Choi I, Kim Y, Polym. Eng. Sci., 39(4), 756 (1999)
Kim W, Bae JW, Kang H, Lee M, Choi ID, J. Korean Ind. Eng. Chem., 8(3), 533 (1997)
Kingery WO, Bower HK, Uhlmann DR, "Introduction to Ceramics," Comprise, Massachusetts, Chap. 18 (1975)
Lupinski JH, "Polymer Materials for Electronics Packaging and Interconnection," American Chemical Society, Washington DC (1989)
Manson SS, "Thermal Stress and Low Cycle Fatigue, Bobrowsky Thermal Shock Parameter," Robert E. Krieger Publishing Company, Malabar, Florida, Section 7.1, 383 (1981)
Manzione LT, "Plastic Packaging of Microelectronic Devices," Van Nostrand Reinhold, New York (1990)
McClean WJ, "Status 1986, A Report of the Integrated Circuit Industry," Integrated Circuit Engineering Corporation (1986)
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Tummala RR, "Microelectronics Packaging Handbook," Van Nostrand Reinhold, New York (1989)
Verma LS, Shrotriya AK, Ramvir S, Chandhary DR, J. Phys. D: Appl. Phys., 24, 1729 (1991)

[Related Articles]

[1] Biernath RW, Soane DS, Contemporary Topic Polym. Sci. (1992)

[2] Incropera FP, Dewitt DP, "Introduction to Heat Transfer," 3(rd) Eds., John Wiley and Sons, New York, 50 (1996)

[3] Kim W, Bae JW, Choi I, Kim Y, Polym. Eng. Sci., 39(4), 756 (1999)

[4] Kim W, Bae JW, Kang H, Lee M, Choi ID, J. Korean Ind. Eng. Chem., 8(3), 533 (1997)

[5] Kingery WO, Bower HK, Uhlmann DR, "Introduction to Ceramics," Comprise, Massachusetts, Chap. 18 (1975)

[6] Lupinski JH, "Polymer Materials for Electronics Packaging and Interconnection," American Chemical Society, Washington DC (1989)

[7] Manson SS, "Thermal Stress and Low Cycle Fatigue, Bobrowsky Thermal Shock Parameter," Robert E. Krieger Publishing Company, Malabar, Florida, Section 7.1, 383 (1981)

[8] Manzione LT, "Plastic Packaging of Microelectronic Devices," Van Nostrand Reinhold, New York (1990)

[9] McClean WJ, "Status 1986, A Report of the Integrated Circuit Industry," Integrated Circuit Engineering Corporation (1986)

[10] Thompson LF, "Polymer for Microelectronics," ACS Symposium Series 537, American Chemical Society, Washington DC (1994)

[11] Tummala RR, "Microelectronics Packaging Handbook," Van Nostrand Reinhold, New York (1989)

[12] Verma LS, Shrotriya AK, Ramvir S, Chandhary DR, J. Phys. D: Appl. Phys., 24, 1729 (1991)