화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Macromolecular Research, Vol.20, No.2, 168-173, February, 2012
DOI10.1007/s13233-012-0025-2  Export Citation
Surface Modification of Polyimide Films by an Ethylenediamine Treatment for a Flexible Copper Clad Laminate
Yun Jun Park, Duk Man Yu, Jeong Ho Ahn1, Jong-Ho Choi2, †, and Young Taik Hong†
  • Energy Materials Research Center, Korea Research Institute of Chemical Technology, Daejeon, 305-600, Korea
  • 1Department of Polymer Science and Engineering, Sungkyunkwan University, Gyeonggi, 440-746, Korea
  • 2Department of New and Renewable Energy, Kyungil University, Gyeongbuk, 712-701, Korea
E-mail:,
The surfaces of the polyimide films Kapton-E and Upilex-S are modified by ethylenediamine treatment to improve its adhesion to a subsequently deposited copper layer. The changes in the chemical composition, morphology, and adhesion properties of the modified polyimide surface are characterized by X-ray photoelectron spectroscopy, atomic force microscopy, and the 90℃ peel test. An ethylenediamine polyimide treatment induces amino group formation from the broken imide group. The peel strength of Kapton-E and Upilex-S with a copper layer increases from 0.3 to 0.65 kgf/cm and 0.25 to 0.46 kgf/cm, respectively. The results show that ethylenediamine treatment is a good modification method to greatly increase the adhesion performance of polyimide films to a copper layer.
Keywords:polyimide film;ethylenediamine;surface modification;adhesion property.
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