Pool boiling enhancement through surface modification has garnered the attention of many researchers for extending the limits of heat flux dissipation. Simulated copper chips were used in a pool boiling setup with water boiling at atmospheric pressure. Heat transfer performance of different microchanneled surfaces was compared to that of a plain surface. The results of the study showed that the mechanism at work for the bubble dynamics was the ability of the surface to pull liquid through the channels to induce heat transfer. Geometrical trends were observed from the study as well with the wider and deeper channels and thinner finned surfaces showing the best heat transfer results. Without reaching the critical heat flux condition, the best performing chip dissipated a heat flux of 244 W/cm(2) corresponding to a record heat transfer coefficient of 269 kW/m(2) K. (C) 2011 Elsevier Ltd. All rights reserved.