Effect of Phosphate-Containing Acrylic Dispersants on Rheological and Dielectric Properties of Carbon Black-Filled Epoxy System

Bui Thanh Son; Nguyen Ngoc Trung; Eun Sung Lee; Jin-Young Bae

Macromolecular Research, Vol.20, No.6, 634-641, June, 2012

DOI10.1007/s13233-012-0093-3 Export Citation

Effect of Phosphate-Containing Acrylic Dispersants on Rheological and Dielectric Properties of Carbon Black-Filled Epoxy System

Bui Thanh Son^†, Nguyen Ngoc Trung, Eun Sung Lee^{1, †}, and Jin-Young Bae

Department of Polymer Science and Engineering, Sungkyunkwan University, Gyeonggi, 440-746, Korea
¹Materials Lab., Samsung Advanced Institute of Technology, Gyeonggi, 449-712, Korea

E-mail:,

This article describes the use of copolymeric dispersants with an acrylic backbone and phosphate side groups for formulating carbon black (CB)-epoxy composites. Six phosphate-modified acrylic copolymer dispersants were prepared from the corresponding epoxy-containing acrylic copolymers. The phosphate-modified dispersant with the highest concentration of hydrophobic alkyl chains and typical phosphate moiety groups showed a desirable passivation effect on the CB, and was found to lower the viscosity of the CB-epoxy paste, leading to the well-cured composite after heat treatment. The thick composite film prepared by employing the CB/phosphate-containing dispersant/epoxy paste was built up on a Cu plate by a screen printing process followed by thermal curing. The dielectric properties of the 3.1 vol% CB-filled epoxy film showed a high dielectric constant (K 6280) and a rather low dissipation factor (Df, 61%) @ 1 MHz.

Keywords:high-k polymer composite;epoxy;carbon black;dielectric constant;dielectric loss;phosphate-containing acrylic dispersant;group transfer polymerization.

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[1] Coombs CP, Printed Circuits Handbook, 6th ed., McGraw-Hill, New York (2007)

[2] Nami Z, Misman O, Erbil A, May GS, J. Cryst.Growth., 179, 522 (1997)

[3] Dimos D, Lockwood SJ, Schwartz RW, Rodgers MS, IEEE Trans. Compon., Packaging Manuf. Technol. Part A., 18, 174 (1995)

[4] Zhang J, Luo SC, Gui LL, J. Mater. Sci., 32(6), 1469 (1997)

[5] Xu J, Moon KS, Tison C, Wong CP, IEEE Trans.Adv. Packaging., 29, 295 (2006)

[6] Lu J, Wong CP, IEEE Trans. Dielectr. Electr. Insul., 15, 1322 (2008)

[7] Raj PM, Balaraman D, Abothu IR, Yoon C, Kang NK, Tummala R, IEEE Trans. Compon. Packaging Technol., 30, 569 (2007)

[8] Lee DI, Choi JY, Lee ES, Ha CS, Han M, Bae JY, J. Appl. Polym. Sci., 104(1), 162 (2007)

[9] Lee DI, Lee SM, Lee ES, Choi JY, Bae JY, J. Appl. Polym. Sci., 105(4), 2012 (2007)

[10] Simms JA, Prog. Org. Coat., 35, 205 (1999)

[11] Webster OW, Adv. Polym. Sci., 167, 1 (2004)

[12] Dicker IB, Cohen GM, Farnham WB, Hertler WR, Laganis ED, Sogah DY, Macromolecules., 23, 4043 (1990)

[13] Hiemenz PC, Principles of Colloid and Surface Chemistry, 3rd ed., Dekker, New York, Chap 4. (1997)

[14] Arico AS, Antonucci V, Minutoli M, Giordano N, Carbon., 27, 337 (1989)

[15] Kim EJ, Shah DO, Langmuir, 18(26), 10105 (2002)

[16] Schueler R, Petermann J, Schulte K, Wentzel HP, J. Appl. Polym. Sci., 63(13), 1741 (1997)

[17] Liang J, Yang Q, J. Appl. Phys., 083508/1, 102 (2007)

[18] Arshak K, Cunniffe C, Moore E, Vaseashta A, Functionalized Nanoscale Materials, Devices and Systems., 2, 321 (2008)

[19] Flandin L, Prasse T, Schueler R, Schulte K, Bauhofer W, Cavaille JY, Phys. Rev. B: Condens. Matter Mater. Phys., 59, 14349 (1999)

[20] Rwei SP, Ku FH, Cheng KC, Colloid Polym. Sci., 280, 1110 (2002)

[21] Ranjbar Z, Rastegar S, Colloids Surf. A: Physicochem.Eng. Asp., 290, 186 (2006)

[22] Devotta I, Mashelkar RA, Chem. Eng. Sci., 51(4), 561 (1996)

[23] Lubin G, Handbook of Composites, Van Nostrand Reinhold, New York,Chap 1. (1982)

[24] Son BT, Kook Y, Lee ES, Bae JY, J. Appl. Polym. Sci., 124(4), 3440 (2012)

[25] Qi L, Lee BI, Chen SH, Samuels WD, Exarhos GJ, Adv. Mater., 17(14), 1777 (2005)

[26] James EM, Nanopackaging: Nanotechnologies and Electronics Packaging, Springer, New York, Chap 7. (2008)