We synthesized an epoxy matrix composite adhesive containing aluminum nitride (AlN) powder, which was used for thermal interface materials (TIM) in high power devices. The experimental results revealed that adding AlN fillers into epoxy resin was an effective way to boost thermal conductivity and maintain electrical insulation. We also discovered a proper coupling agent that reduced the viscosity of the epoxy-AlN composite by AlN surface treatment and increased the solid loading to 60 vol %. For the TIM sample made with the composite adhesive, we obtained a thermal conductivity of 2.70 W/(m K), which was approximately 13 times larger than that of pure epoxy. The dielectric strength of the TIM was 10 to 11 kV/mm, which was large enough for applications in high power devices. Additionally, the thermal and insulating properties of the TIM did not degrade after thermal shock testing, indicating its reliability for use in power devices. (C) 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012