Demolding, the process to separate stamp from molded resist, is most critical to the success of ultraviolet nanoimprint lithography (UV-NIL). In the present study we investigated adhesion and demolding force in UV-NIL for different compositions of a model UV-curable resist system containing a base (either tripropyleneglycol diacrylate with shorter oligomer length or polypropyleneglycol diacrylate with longer oligomer length), a cross-linking agent (trimethylolpropane triacrylate) and a photoinitiator (Irgacure 651). The demolding force was measured using a tensile test machine with homemade fixtures after imprinting the UV resist on a silicon stamp. While decreasing the cross-linking agent content from 49 to 0 wt% has little effect on the resist surface energy, it reduces the resist's elastic modulus drastically. The decrease in elastic modulus results in a decreased adhesion force at the resist/stamp interface thereby facilitating the demolding. The decrease in elastic modulus and, therefore, demolding force by lowering the cross-linking agent content was markedly less pronounced in tripropyleneglycol diacrylate-based resists due to its shorter oligomer length. These general findings will be useful in designing new resists for UV-NIL process. (C) 2011 Elsevier B.V. All rights reserved.