Very thin polydimethylsiloxane (PDMS)-layer with a mean thickness of 3-5 nm was formed on Cu particles by using thermal evaporation of PDMS at 200 degrees C under nitrogen atmosphere. Using X-ray photoelectron spectroscopy and FT-IR, it was shown that the dimethylsiloxane framework was sustained after evaporation of PDMS and its deposition on Cu particles. Initiation temperature for oxidation of Cu was shifted to a higher temperature by more than 50 degrees C in the presence of PDMS-layer, indicating that PDMS can be used as protection layer of metal particles in various applications. (C) 2012 Elsevier B.V. All rights reserved.