Low temperature interconnection processes for lead-free packaging and flexible electronics are currently of great interest. Several studies have focused on bonding using silver nanoparticles (Ag NPs) or copper nanoparticles (Cu NPs). However, pressure assistance is generally necessary for bonding with nanomaterial pastes, which limits its industrial applications. Here, a unique method for bonding of copper wires using Ag NP and nanowire binary pastes is examined, in which joining is accomplished from 60 to 200 A degrees C and yet without the application of pressure. Bonding is facilitated by solid state sintering of Ag nanomaterials and metallic bonding between Cu and Ag interfaces. The effects of different additions of Ag nanowires in bonded joints are studied, in which addition of 20 vol% Ag nanowires improves bonding strength after low temperature sintering by 50-80 % compared with Ag nanoparticle paste. A mechanical reinforcement effect due to introduction of Ag nanowires has been confirmed by observation of the fracture path propagation, where necking, breakage and pullout of nanowires occur on loading. This low temperature pressureless bonding technology has the potential for wide use for interconnection in lead-free microcircuits and flexible electronic packaging.