New composite boards with low-thermal conductivity produced from a mixture of solid wastes from tissue paper manufacturing (solid waste TPM) and corn peel have been developed. The effects of solid waste TPM/corn peel ratio on the properties of the boards were investigated and the possibility of using recycled polystyrene packaging foam as a laminating agent to improve the quality of the boards was also evaluated. Our results show that the density of the particleboards decrease with increasing the amount of corn peel added in the mixture, leading to a decrease in thermal conductivity of the final product. In contrary, larger amount of solid waste TPM added in the mixture produced stronger boards. The lamination of recycled polystyrene on the surface of particleboards improves the mechanical properties and reduces the thickness swelling of the boards. The best improvement in mechanical properties and swelling resistance could be achieved when 15% polystyrene (w/v) was coated on the surface of the boards. (c) 2007 Elsevier Ltd. All rights reserved.