The fracture strength of solvent welded polyamide-11 joints was measured as a function of the time of predrying. The effect of the smoothness of the surface of the adherend, the thermal history of the adherend, and the temperature during the predrying and curing of the bond were investigated. When the adherend surface is polished, the bond is stronger than for a milled surface. For a given predrying time, a higher temperature of predrying gives greater strength as does a higher temperature during curing. The quenched adherend has greater strength than a slow cooled adherend. Under all conditions the fracture strength exhibits a maximum value at an intermediate predrying time. These results are simply explained in terms of the concentration of molecules at the mating surface and the mobility of the molecules during curing.