The increased circuit density on today's computer chips is reaching the heat dissipation limits for air-cooling technology. The direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling with internal flow channels in terms of technological options and challenges. The possibilities presented herein indicate a four- to ten-fold increase in heat flux over the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify research opportunities in meeting the cooling demands of future IC chips. The use of three-dimensional microchannels that incorporate either microstructures in the channel or grooves in the channel surfaces may lead to significant enhancements in single-phase cooling. A simplified and well-established fabrication process is described to fabricate both classes of three-dimensional microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the fabrication process in fabricating complex microstructures within a microchannel.