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2 |
Investigation of Particle Contamination and Removal Mechanism with Corrosion Inhibitors for Cu CMP Application Hae-Jung Pyun, Byoung-Jun Cho, Jin-Yong Kim, Jin-Goo Park 한국재료학회 2017년 봄 학술대회 |
1 |
Development of Non-Amine-based Cleaning Solution for Post-Cu CMP(Chemical Mechanical Planarization) Application Byoung-Jun cho, Xiong Hailin, Jin-Goo Park 한국재료학회 2013년 가을 학술대회 |