| 6 |
Influence of Chloride Ion on Tungsten (W) and Silicon dioxide (SiO2) films for the W Chemical Mechanical Planarization (CMP) process
Jae-Young Bae, Soo-Bum Kim, Eun-Bin Seo, Haneol Choi, Jin-Hyung Park, Jea-Gun Park
한국재료학회 2018년 가을 학술대회 |
| 5 |
Study of Slurry pH and Oxidizer on Ge-doped SbTe for High Speed PRAM CMP
Jun-Hee Shin, Jong Woong Baek, Sang Hwa Woo, Jin Hyung Park, Jea Gun Park
한국재료학회 2013년 가을 학술대회 |
| 4 |
Study of Slurry pH and oxidizer on Ge-doped SbTe film in PRAM CMP
Soo-Beom Kima, Jong-Young Cho, Jae-Hyung Lima, Hee-Sub Hwang, Jin-Hyung Park, Eung-rim Hwang, Jea-Gun Park
한국재료학회 2012년 가을 학술대회 |
| 3 |
Role of H2O2 as oxidizer on the Ge-doped SbTe film for Chemical Mechanical polishing
Sang-Hwa Woo, Jea-Gun Park, Jong-Young Cho, Hao Cui, Eung-Rim Hwang, Jin-Hyung Park
한국재료학회 2012년 가을 학술대회 |
| 2 |
Effect of pH in Colloidal Silica Slurry on Polishing Rate Selectivity of Nitrogen-doped Ge2Sb2Te5 to SiO2 in Chemical Mechanical Polishing
Woong-Jun Hwnag, Jong-Yung Cho, Hao Cui, Jin-Hyung Park, Ungyu Paik, Jea-Gun Park
한국재료학회 2009년 봄 학술대회 |
| 1 |
STI CMP용 나노 세리아 슬러리에서 계면 활성제 분자량의 영향|Effects of molecular weight of surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing
이명윤, 강현구, Takeo Katoh, 박형순, 백운규, 박재근
한국재료학회 2004년 봄 학술대회 |
