번호 | 제목 |
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10 |
Investigation of Particle Contamination and Removal Mechanism with Corrosion Inhibitors for Cu CMP Application Hae-Jung Pyun, Byoung-Jun Cho, Jin-Yong Kim, Jin-Goo Park 한국재료학회 2017년 봄 학술대회 |
9 |
Development of Non-Amine-based Cleaning Solution for Post-Cu CMP(Chemical Mechanical Planarization) Application Byoung-Jun cho, Xiong Hailin, Jin-Goo Park 한국재료학회 2013년 가을 학술대회 |
8 |
Investigation of Sapphire lapping process using Fixed Diamond Abrasive Pad Hailin Xiong, Hyuk-Min Kim, R. Manivannan, Jin-Hyeong Noh, Deog-Ju Moon, Jin-Goo Park 한국재료학회 2012년 가을 학술대회 |
7 |
Development of One Step Transfer Method of Hydrophobic Surface on Polyester Fabric Hassan Hafeez, Si-Hyeong Cho, Dong-Ho Han, Young-Gil Seo, Jin-Goo park 한국재료학회 2012년 가을 학술대회 |
6 |
Effect of anionic polyelectrolyte on Alumina dispersions for Ru chemical mechanical polishing R. Prasanna Venkatesh, S. Noyel Victoria, Tae-Young Kwon, Jin-Goo Park 한국재료학회 2011년 가을 학술대회 |
5 |
Post Ru CMP Cleaning for Alumina Particle Removal Y. Nagendra Prasad, Tae-Young Kwon, In-Kwon Kim, Jin-Goo Park 한국재료학회 2011년 봄 학술대회 |
4 |
Fabrication of Silicon Nanotemplate for Polymer Nanolens Array Si-Hyeong Cho, Hyuk-Min Kim, Jung-Hwan Lee, R. Prasanna Venkatesh, Muhammad Rizwan, Jin-Goo Park 한국재료학회 2011년 봄 학술대회 |
3 |
The Study of Reproduction Ni Mold for Imprinting by Self Assembled Monolayer Method Si-Hyeong Cho, Min-Soo Cho, Kyu-Chae Kim, Hyun-Woo Lim, Jin-Goo Park 한국재료학회 2007년 가을 학술대회 |
2 |
Development of slurry for Ru Chemical Mechanical Planarization In-Kwon Kim, Tae-Young Kwon, Jin-Goo Park, Hyung-Soon Park 한국재료학회 2006년 가을 학술대회 |
1 |
나노 사이즈 hot embossing 공정시 폴리머의 영향|Effect of polymer substrates on nano scale hot embossing Jin-Hyung Lee, Yang-sun Kim, Jin-goo park 한국재료학회 2003년 가을 학술대회 |