화학공학소재연구정보센터
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3 Effects of Organic Additives in Ceria Slurry on Enhanced Oxide-to-Nitride Removal Selectivity in Shallow Trench Isolation Chemical Mechanical Polishing
Byeong-Seog LEE, Hyun-Goo KANG, Kyung-Woong PARK, Ungyu PAIK, Jea-Gun PARK
한국재료학회 2006년 가을 학술대회
2 Effects of Amorphous-silicon and Poly-silicon films on Within-Wafer Non-Uniformity (WIWNU) Improvement in Chemical Mechanical Polishing.
Yoon-Kweon Choi, Jae-Il Choi, Kyung-Woong PARK, Ungyu PAIK, Jea-Gun PARK
한국재료학회 2006년 봄 학술대회
1 Reduction of Large Particles and Light Point Defects (LPD) by Aging and Selective Sedimentation Process in Ceria Slurry for Shallow Trench Isolation Chemical Mechanical Polishing
Byong-Seog Lee, Hyun-Goo Kang, Kyung-Woong Park, Ungyu Paik, Jea-Gun Park
한국재료학회 2006년 봄 학술대회