| 학회 | 한국재료학회 |
| 학술대회 | 2008년 가을 (11/07 ~ 11/07, 차세대융합기술연구원) |
| 권호 | 14권 2호 |
| 발표분야 | 전자재료 |
| 제목 | Studies on Characteristics of Cu Thin/Thick Films Electrodeposited from Pyrophosphate Baths(Pyrophosphate 용액으로부터 전기 도금된 구리 박막/후막의 특성에 관한 연구) |
| 초록 | Recently, several requirements such as the miniaturization, light weight and the decrease of physical sizes in electronic devices have been required. PCB (printed circuit board) for these electronic devices is trending toward highly lucrative rigid + flex type or all flex type. Flexible printed circuit board (FPCB) is used to wire connector, and chip on flex (COF), because of its flexibility, elasticity, and light weight. Flexible copper clad laminate (FCCL) is used for the raw material of FPCB. Generally, FCCL has been fabricated by sputtering on polyimide film to make seed layer and then electrodeposit copper film on it. Electrodeposition processes are one of the important processes to fabricate FCCL and have many good advantages compared to vacuum processes. For example, it well-suited to fulfill the requirements of high yield, cost effective processes, and easy scales up. Also it may electodeposit on any forms and has an ability to control the film thickness from few nanometers to millimeters. In this work, Cu films were electrodeposited from pyrophosphate baths. The influences of current density, operating temperature, solution pH, Cu ion concentration and additive in plating baths on the Cu thin film were investigated. Characterizations of Cu thin films (e.g. microstructure, surface morphology and residual stress) were carried out using XRD, SEM and stress analyzer. Other details will be discussed further. |
| 저자 | 신동율, 박덕용, 구본급 |
| 소속 | 한밭대 |
| 키워드 | FCCL; FPCB; Cu thin film; Pyrophosphate |
