| 초록 |
Nowadays, advances electric industries made needs for low dielectric materials for application. The low dielectric materials are expected to play crucial roles in next generation of microelectronics technology. In the research, Nano porous polyimide silica aerogel composite films were synthesized. The flat, thin, well dispersed films were fabricated. The films were differed by portion of silica aerogel among the imide composite. In this work, the silica aerogel composite films were made for 1~10%. The dielectric data were measured by PM6304 (Fluke, USA), it showed very low dielectric constants which approaches about 2.41 when the content of silica aerogel was about 10%. The thermal properties were verified in order to check the complete polyimidization reaction of silica aerogel composite film. The aerogel films are composited well, in good quality and are strong enough to be prepared for specific applications. The aerogel films exhibit bulk structure, therefore can be applicated in various parts in optical, acoustical, thermal and electronic fields. |
