| 초록 |
Nowadays, the developments in modern electronics have stimulated the use of polyimide materials in various industries. Modification and improvements in polyimide film is also focused by many researchers. In this work, carbon black and CNTs are added into the film to improve its thermal and electronic properties. The thermal decomposition temperature of polyimide film blended with carbon black is highly increased by 3~40°C, the decomposition temperature increases as carbon loading increases. The highest thermal decomposition temperature reaches at 520°C, and the glass transition temperature to 308°C. However, the mechanical strength of polyimide film decreased because of inorganic fillers. But its electronic resistance decreased in a great range, which can be widely applicable in various areas. |
