| 초록 |
The current trend in the interconnect development is to incorporate polymer layers together with glass or ceramic layers to form a multilayered wiring structure. Poly(amic acid) is widely used in the fabrication of devices because of its easy synthesis. However, it is in the equilibration with the dianhydride and amine monomer and is very sensitive to the moisture contact. Another processable precursor, poly(amic dialkyl ester) has a high hydrolytic stability due to the absence of monomer-precursor polymer equilibrium. This derivative poly(amic ester) has improved solubility, better resistance to hydrolytic degradation, an apparent lack of exchange reactions in solution containing different polyimide precursors, and high solids content with low viscosity which results in enhanced processability for many application. In this abstract, we wish to systematically describe the synthesis and thermal imidization of poly(amic ester) derived from a series of aromatic dianhydrides and the diamine. And for multilayered device, there are often reliability problems, such as displacement, cracks, and delamination at interfaces. The mismatch in thermal expansion coefficient and the Young’s modulus will generate thermal stress in the metal/polymer structure during thermal cycling[1,2]. Since thermal cycling is a typical procedure during fabrication and polymer curing, it is important to understand the mechanical properties of the metal/polymer structure, particularly the nature of stress relaxation during thermal cycling.
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