| 초록 |
Recently, electronic devices generate a lot of heat, which causes heat to deteriorate the life and reliability of electronic components. Therefore, it is necessary to develop a heat dissipation material that emits heat from electronic devices. Conventional curing method uses a thermal curing method. In this case, the resolution is lowered and the substrate is damaged due to a long curing time. In order to overcome these drawbacks, it introduced 3D printing technique using IR curing method. In this study, we prepared a photocurable epoxy inks with high thermal conductivity for 3D printing application. In order to increase the thermal conductivity of the ink material, high thermal conductivity graphene and boron nitride were used as fillers. In particular, the graphene used in ink is used as ir absorber which absorbs the ir light source while being a filler for improving the thermal conductivity. We get a maximum thermal conductivity of 2.767W/m·k, which is 1330% higher than pure epoxy. |
