| 학회 |
한국고분자학회 |
| 학술대회 |
2018년 봄 (04/04 ~ 04/06, 대전컨벤션센터) |
| 권호 |
43권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Pressure sensitive adhesive fabrication based on polyisobutylene for flexible OLED encapsulation |
| 초록 |
For flexible OLED encapsulation face seal method was developed by applying the adhesive to entire surface of device. Polyisobutylene(PIB) is one of the promising candidates for OLED encapsulation adhesive due to its low gas permeation and transparent property. However, it does not have sufficient reliability at high temperature and humidity conditions because of its low cohesion and adhesion property. In this study, we improved cohesion and adhesion property of PIB by using acryl polymer and DCPD(Dicyclopentadien) tackifier. Creep test results showed that the creep extension of PIB was 531.46㎛ while that of PIB using acryl polymer improved to 101.47㎛. Adhesion also increased linearly with increasing tackifier content. It was applied to OLED device with a barrier film and calcium cell test was conducted to examine the barrier property enhancement. |
| 저자 |
김성돈, 김성수
|
| 소속 |
경희대 |
| 키워드 |
OLED encapsulation; PSA; adhesive; polyisobutylene; barrier
|
| E-Mail |
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