| 학회 |
한국고분자학회 |
| 학술대회 |
2021년 가을 (10/20 ~ 10/22, 경주컨벤션센터) |
| 권호 |
46권 2호 |
| 발표분야 |
대학원생 구두발표(발표15분) |
| 제목 |
Solvent free dual-cure adhesives with epoxy acrylate oligomer using carboxylized monomer |
| 초록 |
Dual-cure adhesives have a composition that can be cured by a separate curing method with different bonding mechanism. We synthesized a novel epoxy acrylate (EA) oligomer using carboxylized monomer and applied it to a thiol/acrylate/epoxy adhesive system to investigate the characteristics of dual-cure. We suggested a mechanism for EA synthesis and photo/ thermal dual-cure. We confirmed the structure of the synthesized EA using FT-IR and NMR spectroscopy. Furthermore, we measured lap-shear strength and peel strength according to molar ratio of EA oligomer and thiol/acrylate/epoxy using a universal testing machine. The adhesion properties of dual-cure adhesives using EA oligomers were observed to be superior to those of dure-cure ones using commercial EA oligomer. In addition, storage stability of dure-cure adhesives according to the content of the stabilizer and gel fraction of dual-cure adhesives were evaluated. |
| 저자 |
김해찬1, 김정수1, 문석규1, 권용록1, 김종호2, 김동현1
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| 소속 |
1한국생산기술(연), 2한양대 |
| 키워드 |
Dual-cure; Adhesion; Lap-shear strength; Peel strength; Storage stability.
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| E-Mail |
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