| 초록 |
Epoxy resin containing more than one glycidyl groups forms the network structure with curing agent. Epoxy resin with three dimensional network structure is generally used as adhesives, materials for construction, and coatings for strengthening of surface or anti-corrosion owing to its excellent characteristics such as good adhesion, good chemical resistance, and good erosion-corrosion resistance. In this study, copper powder was used as an additive in order to improve the electrical properties of epoxy. The effect of the additive content on the cure kinetics and chemorheology during cure of epoxy resin were studied by using DSC and rheometer. The electrical and physical properties with additive content were also examined. |
