| 학회 | 한국공업화학회 |
| 학술대회 | 2014년 봄 (04/30 ~ 05/02, 제주국제컨벤션센터) |
| 권호 | 18권 1호 |
| 발표분야 | 포스터-정보.전자소재 |
| 제목 | Study of IT epoxy adhesive low temperature curing characteristics |
| 초록 | LED(light emitting diode) has been used in various fields because it has a lot of advantages with their high efficiency, long-lived and high-speed response. Recently, continued development is ongoing for the development of an epoxy adhesive and technology related to the BLU(back light unit)’s low cost price. In case of epoxy adhesive, the composition of the adhesive is very important to request a severe curing characteristics. In this study, we measured the gel time and low temperature curing properties and examined changes according to the composition in the properties of the adhesive. |
| 저자 | 류주민1, 김석조2, 신교직1, 최경호1, 이상국1 |
| 소속 | 1한국생산기술(연), 2호서대 |
| 키워드 | epoxy adhesive; low temperature curing; IT epoxy |
