| 초록 |
Rod-like polyimide(BPDA-PDA) exhibits a high chain rigidity, relatively low residual stress, low TEC, high modulus, high strength and is thermally stable. but it exhibits a relatively high water sorption and is too brittle and fragile for electronic devices. In this study, we attempted to improve its water sorption properties and to heal its brittleness by introducing PDMS rubber phases into PI polymer backbone. First of all, we synthesized high toughness PAA by mixing BPDA and (m,p)-PDA. And we added epoxysilane as a coupling agent into PAA solution so that the bond strength between the newly produced rubber phase and PAA matrix enhanced. After the addition of a selected amount of DEDMS and water to PAA-epoxysilane reactant, hydrolysis and condensation reaction was conducted for Fabricating PAA-PDMS composites. PAA-PDMS composites converted it to the final PI-PDMS composites. PI-PDMS composites was characterized by various apparatus. |
