| 학회 |
한국고분자학회 |
| 학술대회 |
2010년 가을 (10/07 ~ 10/08, 대구 EXCO) |
| 권호 |
35권 2호 |
| 발표분야 |
기능성 고분자 |
| 제목 |
Photo-patternableAdhesives for Wafer Level Image SensorPackaging |
| 초록 |
Photo-patternable non-conductive adhesives (NCAs) have been newly developed. The new photo-patternable and thermo-curable NCAs were coated on a wafer and patternwise exposed to UV light. The film in the exposed areas was dissolved in an aqueous base solution. The new NCAs can be patterned without damaging thermo-curable functional groups. The wafer with patterned NCA was singulated and the diced chips were flip chip assembled on flexible printed circuit boards through curing of pattened NCAs at 180℃ in 10 seconds. New photo-patternable NCAs showed the same stable contact resistance and adhesion strength as conventional NCA flip chip assembles. |
| 저자 |
김 일, 조영욱, 김진백, 백경욱
|
| 소속 |
KAIST |
| 키워드 |
adhesive; Photopatterning
|
| E-Mail |
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