화학공학소재연구정보센터
학회 한국화학공학회
학술대회 2007년 가을 (10/26 ~ 10/27, 한국과학기술원)
권호 13권 2호, p.1318
발표분야 고분자
제목 Preparation and characterization of polyimide films modified by plasma treatments for copper metallization
초록 In this work, Kapton-H (pyromellitic dianhydride/oxydianiline), one of polyimide films, was modified by CHF3/He plasma treatment. Surface modified polyimide films were analyzed by X-ray photoelectron spectroscopy (XPS), Fourier transform-IR (FT-IR) spectroscopy, atomic force microscopy (AFM). Changes in wettability were evaluated by measuring a contact angle with the sessile drop method. After a deposition of copper on surface modified polyimide films, an adhesion strength of the copper/polyimide system was measured. From the results, it was found that the plasma treatment successfully introduced fluorine functional groups on the polyimide surfaces. AFM and sessile drop method indicated the surface roughness and the surface energy of polyimide films were much increased by plasma treatment. The results explained the increased peel strengths of polyimide films with copper.
저자 손희진1, 김 석1, 박수진2
소속 1한국화학(연), 2인하대
키워드 polyimide; CHF3/He plasma; wettability; peel strengths
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