| 초록 |
To reduce in the coefficient of thermal expansion (CTE) of polyimide (PI) film, we used ZnS particles as filler particles. Surface of ZnS particles was modified with (3-mercaptopropyl)trimethoxysilane (MPTMS) to create hydroxyl groups for preventing agglomeration of ZnS particles. For comparison, SiO2 and ZrW2O8 particles that have been reported as fillers for polymer films were also synthesized. CTE measurements showed that the ZnS particles produce PI nanocomposite films with lower CTE than the SiO2 and ZrW2O8 particles at the same concentration. In particular, the surfacemodified ZnS particles showed the lowest CTE (13 ppm/K) at 15 wt%. To rationalize the significant reduction in CTE with the surfacemodified ZnS particles, the intrinsic CTE and thermal conductivity, thermoluminescence property, and dispersion state of ZnS particles were considered. We found that the intrinsic thermal conductivity and dispersion state of ZnS particles were mainly responsible for the reduction in CTE at low particle concentration. |
