| 초록 |
Polyimide (PI)/poly(vinylsilsesquioxane) (PVSSQ) (PI/PVSSQ) hybrid composite films were prepared from 3,3’, 4,4’-biphenyltetracarboxylic dianhydride (BPDA)-phenyldiamine (PDA) polyamic acid and triethoxyvinylsilane (TEVS or VSSQ) via sol-gel process and thermal imidization. The presence of the PVSSQ showed a remarkable effect on the microstructure and properties of the polyimide based hybrid composite films. The presence of nanoparticles distribution and compatibility were confirmed by scanning electron microscope (SEM). Incorporating of PVSSQ into polyimide matrix increased the thermal stability and Tg of the resulting hybrid composites. The presence of the PVSSQ also showed significant effect on the mechanical properties of the polyimide films. |
