| 학회 | 한국재료학회 |
| 학술대회 | 2010년 가을 (11/11 ~ 11/12, 무주리조트) |
| 권호 | 16권 2호 |
| 발표분야 | E. Advanced Materials and processing Technology(첨단재료공정기술) |
| 제목 | 전류밀도에 의한 구리 박막의 표면형상과 물성변화 |
| 초록 | ABSTRACT This study examined the effects of plated current density on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various current density. Large particles were observed on the surface of the copper layer electroplated onto the current density of 25 mA/cm2. However, a uniform surface, lower resistivity and high flexibility were obtained when a current density of 10 mA/cm2. |
| 저자 | 정광희, 우태규, 박일송, 설경원 |
| 소속 | 전북대 |
| 키워드 | Current density; Peel strength; Resistivity; Flexibility; Sputter. |
