| 초록 |
Thermal conductive composites were fabricated using a boron nitride (BN) filler and polyethylene naphthalate (PEN) matrix. To enhance the interfacial affinity, two types of silane curing agents, 3-aminopropyl triethoxysilane (APTES) and phenyl triethoxysilane (PTEOS), were introduced onto the BN particle surfaces. The modified BN particles were embedded in a PEN matrix via a melt mixing process using twin extrusion to form APTES@BN and PTEOS@BN composites. The highest thermal conductivity was exhibited at 50 wt% BN (1.41 W/mK), which increased to 1.54 W/mK and 1.63 W/mK when the BN particles were surface treated. These values were 9% and 16% higher than the thermal conductivities of the pure BN and the PEN matrix, respectively. The surface-treated composite also showed improved storage moduli and tensile strength because of the improved interfacial adhesion and the interaction between the BN filler and the PEN matrix. POLYM. COMPOS., 2017. © 2017 Society of Plastics Engineers |
