| 학회 |
한국공업화학회 |
| 학술대회 |
2006년 봄 (05/12 ~ 05/13, 전북대학교) |
| 권호 |
10권 1호 |
| 발표분야 |
접착제도료잉크 |
| 제목 |
Thermal stability of additives for UV-crosslinkable hotmelt pressure sensitive adhesive by TGA and DSC |
| 초록 |
The styrene-butadiene-styrene(SBS) based PSA shows high cohesion and good PSA performance at ambient temperature. This cohesion is acquired by physical crosslinking which is collapsed at elevated temperature. so shows poor heat resistance. The solution to overcome poor heat resistance of SBS based PSA is fushion technology between hotmelt system and UV curing system to induce the chemical crosslinking. The thermal stability of additives for UV curing is important related to both degree of UV crosslinking and manufacture cost. |
| 저자 |
임동혁1, 도현성1, 박진희1, 김현중1, 방정석2, 윤관희2
|
| 소속 |
1서울대, 2(주)빅솔에이엔씨 |
| 키워드 |
UV curing; photoinitiator; photocrosslinker; hotmelt PSA
|
| E-Mail |
|
